Low Expansion Package for Deep Ultraviolet LED
In the manufacturing of deep ultraviolet LED packages, the yield during sealing improves. Enhancing the package's airtightness and heat dissipation can lead to increased device longevity.
Reduces crack formation due to thermal expansion differences at the joint when using quartz glass as a cover glass. The yield during sealing improves. The airtightness of the package is also enhanced due to material properties and metallization processing. The through-via structure improves heat dissipation, which is expected to extend the device's lifespan. 【Features】 ■ The expansion coefficient of the package is about 1/4 that of aluminum nitride, resulting in good bonding compatibility with quartz glass and improved reliability. ■ The porosity is as small as that of ceramics, and the airtightness of the package is enhanced by metallized sealing. ■ By reducing the difference in expansion coefficients, the yield in the production process (during sealing) is improved. 【Examples of Applications】 ■ Glass ceramic package for sealing deep ultraviolet (UVC) LEDs ■ Glass ceramic package for sealing deep ultraviolet (UVC) sensors
- Company：鳴海製陶 産業器材事業部門
- Price：Other
